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InterSICOP organises COPAN20, the leading bread congress

It will be held on Tuesday 28 April at the South Auditorium at IFEMA under the slogan “Wheat the future holds”.

03 Feb 2020

InterSICOP and ASEMAC (Spanish Association for the Bread, Bakery and Pastry Industry), in collaboration with CEOPPAN (Spanish Confederation of Bread, Bakery and Pastry and Related Products) and AFHSE (Association of Flour and Semolina Manufacturers of Spain), is organising COPAN20, the leading bread congress, set for Tuesday 20 April 2020 at IFEMA.

Under the slogan “Wheat the future holds”, the event will analyse some of the topics that most interest and concern professional bakers:

  • Nutrition and functionality of bread
  • The bread quality standard one year later. Legislative challenges
  • Trends in raw materials
  • ECO-nsumer
  • Bread in cutting-edge cuisine
  • Forecasts and markets
  • Bread in the cloud

With this initiative, InterSICOP consolidates itself as a necessary instrument to boost the positioning, development, growth and visibility of baking, one of the sectors represented at the fair.